Custom Thermoelectric Separation Structure Technology Copper Base
In today&#8217;s fast-evolving technological landscape, Thermoelectric Separation Structure Technology is paving the way for innovative solutions that enhance efficiency and sustainability across various sectors. This technology utilizes sophisticated thermoelectric materials to achieve superior thermal management solutions, making it a force to reckon with in the realm of solid-state cooling and thermoelectric power generation.
<img loading="lazy" decoding="async" src="https://pinshop123.pinshop.com/wp-content/uploads/2024/12/H4f650916bb374724b1c35887259aeaf74.jpg" alt="Thermoelectric Separation Structure Technology" width="800" height="800" data-src="https://pinshop123.pinshop.com/wp-content/uploads/2024/12/H4f650916bb374724b1c35887259aeaf74.jpg" />MANKUN, a leading Chinese manufacturer renowned for its lighting application electronic components, epitomizes the utilization of advanced thermoelectric technology in their impressive array of products. Founded on a legacy of quality and innovation, GUANGZHOU MANKUN ELECTRONIC., LTD. serves as a dynamic beacon of customer-focused breakthroughs. From PCB circuit boards to LED modules and wireless solutions, MANKUN has successfully integrated thermoelectric materials into its product range to enhance thermoelectric efficiency and electrical efficiency. Their commitment to innovation is further exemplified through constant product updates, offering customized solutions that surpass traditional technology.
One of MANKUN&#8217;s standout innovations is the microwave motion sensor module, a perfect blend of thermoelectric device capabilities and sleek design. This state-of-the-art component is crafted to integrate seamlessly into smart home or security systems, offering superior motion detection capabilities even in challenging environments. The module&#8217;s flexible architecture not only ensures easy integration but also supports extensive customization, catering to both DIY enthusiasts and seasoned professionals. Engineered for durability and optimized for efficient power conservation, this module represents the pinnacle of thermoelectric performance.
Through rigorous research and development, MANKUN prioritizes compliance with international safety and performance standards, accredited by trusted bodies such as UL, SGS, CQC, ROHS, and CE. Their strategic approach to market evolution and transformation highlights a profound understanding of thermoelectric modeling and its application in critical fields such as aerospace. MANKUN&#8217;s mission extends beyond mere product supply; they aspire to be a reliable partner and industry reference point, shaping futuristic solutions through thermoelectric power plants and pioneering prototypes.
Embrace the transformative potential of Thermoelectric Separation Structure Technology with MANKUN’s cutting-edge offerings. Equip your systems with their leading microwave motion sensor module and experience a new dimension of efficiency and reliability. As the world leans towards sustainable and high-performance technologies, MANKUN stands at the forefront, leading the charge with expertise and a vision for a brighter, electrifying future.
<img loading="lazy" decoding="async" src="https://pinshop123.pinshop.com/wp-content/uploads/2024/12/Hd6a2fb042e5a4db7b7b6dcacc6851a75F.png" alt="Thermoelectric Separation Structure Technology" width="1000" height="1053" data-src="https://pinshop123.pinshop.com/wp-content/uploads/2024/12/Hd6a2fb042e5a4db7b7b6dcacc6851a75F.png" />

Custom Thermoelectric Separation Structure Technology Copper Base

Single Layer PCB

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Technical parameters and process capability of metal substarte(MCPCB)
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ITEM
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SPECIFICATION
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Surface
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LF HASL,immersion gold,immersion siliver,OSP
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Layer
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Single side,double sided Multilayer and special structure
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Maximum PCB size
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240mmx1490mm OR 490x1190mm
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PCB thickness
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0.4-3.0mm
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Copper Foil thickness
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H 1/2/3/4(oz)
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Insulation layer thickness
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50/75/100/125/150/175/200(um)
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Metal Base thickness
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AIuminum(1100/3003/5052/6061),Copper AIuminum
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Metal Base thickness
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0.5/0.8/1.0/1.2/1.6/2.0/3.2/5.0(mm)
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Shaping
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Die punching/CNC Route/V-Cut
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Test
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100% open&amp;short test
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Shaping tolerance
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Die Punching&lt;+- 0.05mm,CNC Route&lt;+-0.15mm,V-CUT Thick residue&gt;+-0.15mm
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Hole tolerance
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+-0.5mm
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Min.Hole DIameter
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Single side 0.5/Double sided PTH0.3MM
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Solder mask
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green/white/black/red/yellow
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Min.letter height
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0.8mm
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Min.line space
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0.15
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Min.letter width
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0.15
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Sile screen color
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blue/white/black/red/yellow
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Sopecial hole
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Spot facing/cup hole/buried via hole/buried tank
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File format
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Gerber,Protel,PowerPCB,AutoCAD etc
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</table>

MANKUN

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